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题名: The Application of High Impedance Surface for Noise Reduction inside the Package
作者: Wei, Xing-Chang;  Wei, Xin;  Li, Yong-Sheng;  Zhang, Jian-Bo;  Li, Er-Ping;  Dai, Gao-Le
发表日期: 2014
会议日期: AUG 03-08, 2014
会议名称: IEEE International Symposium on Electromagnetic Compatibility (EMC)
Appears in Collections:2015专题_期刊论文

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Recommended Citation:
Wei, Xing-Chang,Wei, Xin,Li, Yong-Sheng,et al.The Application Of High Impedance Surface For Noise Reduction Inside The Package[J],2014.

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