NIMTE OpenIR  > 2018专题
Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference
Xiao, Kui; Gao, Xiong; Yan, Lidan; Yi, Pan; Zhang, Dawei; Dong, Chaofang; Wu, Junsheng; Li, Xiaogong
2018
发表期刊CHEMICAL ENGINEERING JOURNAL
卷号336页码:92-101
摘要The climate in Turpan is perennial drought with little rainfall, which usually results in the corrosion of metals. This weak corrosion can cause the paralysis of electronic components in service conditions. To study the corrosion mechanism associated with copper-clad plate (PCB-Cu) in a dry-heat desert environment, Turpan (China) was elected as an outdoor exposure site. The morphologies of the PCB-Cu and the composition of the corrosion products were analyzed. In addition, the corrosion behavior of PCB-Cu in a simulated indoor environment was also investigated. The results showed that the corrosion morphology was halo-shaped in the initial corrosion stage, which was attributed to water condensation on dust due to the large diurnal temperature difference of the environment.
关键词Thin Electrolyte Layer Raman-spectroscopy Relative-humidity Ion concentratIon Chloride Media Copper Behavior Alloys Silver H2s
学科领域Engineering
语种英语
文献类型期刊论文
条目标识符http://ir.nimte.ac.cn/handle/174433/16757
专题2018专题
推荐引用方式
GB/T 7714
Xiao, Kui,Gao, Xiong,Yan, Lidan,et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference[J]. CHEMICAL ENGINEERING JOURNAL,2018,336:92-101.
APA Xiao, Kui.,Gao, Xiong.,Yan, Lidan.,Yi, Pan.,Zhang, Dawei.,...&Li, Xiaogong.(2018).Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference.CHEMICAL ENGINEERING JOURNAL,336,92-101.
MLA Xiao, Kui,et al."Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference".CHEMICAL ENGINEERING JOURNAL 336(2018):92-101.
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