NIMTE OpenIR  > 2018专题
Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference
Xiao, Kui; Gao, Xiong; Yan, Lidan; Yi, Pan; Zhang, Dawei; Dong, Chaofang; Wu, Junsheng; Li, Xiaogong
2018
Source PublicationCHEMICAL ENGINEERING JOURNAL
Volume336Pages:92-101
AbstractThe climate in Turpan is perennial drought with little rainfall, which usually results in the corrosion of metals. This weak corrosion can cause the paralysis of electronic components in service conditions. To study the corrosion mechanism associated with copper-clad plate (PCB-Cu) in a dry-heat desert environment, Turpan (China) was elected as an outdoor exposure site. The morphologies of the PCB-Cu and the composition of the corrosion products were analyzed. In addition, the corrosion behavior of PCB-Cu in a simulated indoor environment was also investigated. The results showed that the corrosion morphology was halo-shaped in the initial corrosion stage, which was attributed to water condensation on dust due to the large diurnal temperature difference of the environment.
KeywordThin Electrolyte Layer Raman-spectroscopy Relative-humidity Ion concentratIon Chloride Media Copper Behavior Alloys Silver H2s
Subject AreaEngineering
Language英语
Document Type期刊论文
Identifierhttp://ir.nimte.ac.cn/handle/174433/16757
Collection2018专题
Recommended Citation
GB/T 7714
Xiao, Kui,Gao, Xiong,Yan, Lidan,et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference[J]. CHEMICAL ENGINEERING JOURNAL,2018,336:92-101.
APA Xiao, Kui.,Gao, Xiong.,Yan, Lidan.,Yi, Pan.,Zhang, Dawei.,...&Li, Xiaogong.(2018).Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference.CHEMICAL ENGINEERING JOURNAL,336,92-101.
MLA Xiao, Kui,et al."Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference".CHEMICAL ENGINEERING JOURNAL 336(2018):92-101.
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