NIMTE OpenIR  > 2018专题
Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
Hu, F. Q.; Zhang, Q. K.; Jiang, J. J.; Song, Z. L.
2018
Source PublicationMATERIALS LETTERS
Volume214Pages:142-145
AbstractIn this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained. (C) 2017 Elsevier B.V. All rights reserved.
KeywordMechanical-properties Alloying Substrate Tensile Properties Bi Segregation Joints Embrittlement Temperature Melt
Subject AreaPhysics
Language英语
Document Type期刊论文
Identifierhttp://ir.nimte.ac.cn/handle/174433/16791
Collection2018专题
Recommended Citation
GB/T 7714
Hu, F. Q.,Zhang, Q. K.,Jiang, J. J.,et al. Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction[J]. MATERIALS LETTERS,2018,214:142-145.
APA Hu, F. Q.,Zhang, Q. K.,Jiang, J. J.,&Song, Z. L..(2018).Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction.MATERIALS LETTERS,214,142-145.
MLA Hu, F. Q.,et al."Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction".MATERIALS LETTERS 214(2018):142-145.
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