NIMTE OpenIR  > 2018专题
Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study
Liu, Zengjia; Zheng, Shaoxian; Lu, Zhibin; Pu, Jibin; Zhang, Guangan
2018
Source PublicationCARBON
Volume127Pages:548-556
AbstractTribological behavior of Cu is peculiar among soft metal when it rubs on diamond flat in experiments, and passivating element F and H at Cu/diamond interface can affect mechanical properties and even tribological characteristics as well, related special adhesive transfer (fracture location) and adhesion tuning mechanism at Cu/diamond interface remain obscure. Here, we investigate the interfacial structure change, electronic and mechanical properties of Cu/diamond and interface with fully F passivation (Cu/diamond: F) through first-principles calculations. The study shows that Cu(111)/diamond(111) interface exhibits the special phenomenon of adhesive transfer (different cleavage location and interfacial strength under applied load) due to adhesion, and this contribute to different frictional properties among soft metal. The effect on mechanical properties of F at Cu/diamond interface is studied systematically, passivation of fluorine on diamond surface reduces work of separation of the interface significantly, from 3.64 to 0.02 J/m(2). Combining with kinetic analysis, we gain that fluorine might be a kind of promising adhesion-reducing element at interface and improve related tribological characteristics of Cu(111)/diamond( 111) system. The results of this study benefit the understanding of different tribological properties of Cu/diamond system, adhesion reduction mechanism of fluorine at interface and its effect on tribological behavior at atomic scale. (C) 2017 Elsevier Ltd. All rights reserved.
KeywordDiamond-like Carbon Ab-initio Electronic-structure 1st Principles Surface-energy Dangling-bond Hydrogen Friction Reconstruction Films
Subject AreaMaterials Science
Language英语
Document Type期刊论文
Identifierhttp://ir.nimte.ac.cn/handle/174433/16848
Collection2018专题
Recommended Citation
GB/T 7714
Liu, Zengjia,Zheng, Shaoxian,Lu, Zhibin,et al. Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study[J]. CARBON,2018,127:548-556.
APA Liu, Zengjia,Zheng, Shaoxian,Lu, Zhibin,Pu, Jibin,&Zhang, Guangan.(2018).Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study.CARBON,127,548-556.
MLA Liu, Zengjia,et al."Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study".CARBON 127(2018):548-556.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Liu, Zengjia]'s Articles
[Zheng, Shaoxian]'s Articles
[Lu, Zhibin]'s Articles
Baidu academic
Similar articles in Baidu academic
[Liu, Zengjia]'s Articles
[Zheng, Shaoxian]'s Articles
[Lu, Zhibin]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Liu, Zengjia]'s Articles
[Zheng, Shaoxian]'s Articles
[Lu, Zhibin]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.