NIMTE OpenIR  > 2018专题
Microfabrication of conductive copper patterns by meniscus-confined electrodeposition
Lei, Yu; Gao, Fangpu; Guo, Jianjun; Xu, Gaojie; Yang, Yitao
2018
Source PublicationINTEGRATED FERROELECTRICS
Volume190Issue:1Pages:164-172
AbstractComplex three-dimensional copper (Cu) wires have been successfully fabricated by meniscus-confined electrodeposition (MCED) controlled by quasi-static stability of the meniscus. Here, we report a new dynamic meniscus stability based MCED process. The obtained copper microwires are straight, uniform in width and have a smooth surface (surface finish of 8.79nm (Ra)). When current density higher than 31.81 mA/cm(2), dense Cu microstructure is deposited on the cathode substrate, while current density between 12.13 mA/cm(2) and 31.81 mA/cm(2), sparsity structure was observed on the surface of the copper wire. This work provides a direct method to fabricate Cu microwires on conductive substrates without the use of additives.
KeywordFabrication Electrolyte Microscope Probe Wire
Subject AreaEngineering
Language英语
Document Type期刊论文
Identifierhttp://ir.nimte.ac.cn/handle/174433/16891
Collection2018专题
Recommended Citation
GB/T 7714
Lei, Yu,Gao, Fangpu,Guo, Jianjun,et al. Microfabrication of conductive copper patterns by meniscus-confined electrodeposition[J]. INTEGRATED FERROELECTRICS,2018,190(1):164-172.
APA Lei, Yu,Gao, Fangpu,Guo, Jianjun,Xu, Gaojie,&Yang, Yitao.(2018).Microfabrication of conductive copper patterns by meniscus-confined electrodeposition.INTEGRATED FERROELECTRICS,190(1),164-172.
MLA Lei, Yu,et al."Microfabrication of conductive copper patterns by meniscus-confined electrodeposition".INTEGRATED FERROELECTRICS 190.1(2018):164-172.
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