NIMTE OpenIR  > 2018专题
Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing
Zhou, Xiaobing; Li, Youbing; Li, Yifan; Liu, Zhen; Yang, Hui; Ding, Shurong; Han, Young-Hwan; Lee, Jaehyung; Du, Shiyu; Huang, Qing
2018
发表期刊INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY
卷号15期号:5页码:1157-1165
摘要Residual thermal stresses in SiC/Ti3SiC2/SiC joining couples were calculated by Raman spectra and simulated by finite element analysis, and then relaxed successfully by postannealing. The results showed that the thermal residual stress between Ti3SiC2 and SiC was about on the order of 1 GPa when cooling from 1300 degrees C to 25 degrees C. The thermal residual stresses can be relaxed by the recovery of structure disorders during postannealing. When the SiC/Ti3SiC2/SiC joints postannealed at 900 degrees C, the bending strength reached 156.9 +/- 13.5 MPa, which was almost twice of the as-obtained SiC/Ti3SiC2/SiC joints. Furthermore, the failure occurred at the SiC matrix suggested that both the flexural strength of joining layer and interface were higher than the SiC matrix.
关键词Ti3sic2 Tape Film Raman-spectroscopy Silicon-carbide Sic Ceramics Mechanical-properties Sintering Technique 6h Polytype Temperature Composites Field
学科领域Biochemistry & Molecular Biology ; Chemistry ; Polymer Science
语种英语
文献类型期刊论文
条目标识符http://ir.nimte.ac.cn/handle/174433/17235
专题2018专题
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GB/T 7714
Zhou, Xiaobing,Li, Youbing,Li, Yifan,et al. Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing[J]. INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY,2018,15(5):1157-1165.
APA Zhou, Xiaobing.,Li, Youbing.,Li, Yifan.,Liu, Zhen.,Yang, Hui.,...&Huang, Qing.(2018).Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing.INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY,15(5),1157-1165.
MLA Zhou, Xiaobing,et al."Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing".INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY 15.5(2018):1157-1165.
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