NIMTE OpenIR  > 2018专题
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity
Xiao, Kui; Bai, Ziheng; Yan, Lidan; Yi, Pan; Dong, Chaofang; Wu, Junsheng; Hu, Yuting; Xiong, Ruilin; Li, Xiaogang
2018
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume29Issue:11Pages:8877-8885
AbstractThe microporous corrosion is the main surface failure mechanism of gold-plated components. The microporous corrosion behavior of electroless nickel and immersion gold (ENIG)-plated printed circuit boards (PCBs) in Turpan area which has an atmospheric environment with high salinity was investigated via a field exposure method for 24 months, as well as 3D analysis, FIB technology, composition analysis, and electrochemical impedance spectroscopy and corrosion mechanism model. After 6 months of exposure, the corrosion products filled up the pores and clustered on the surface as mound shape, and a possible corrosion mechanism model was displayed in the study after 24 months of exposure. The results showed that PCB-ENIG mainly suffered microporous corrosion in a high salinity atmospheric environment. The pores on the gold-plated coating were location where corrosion occurred first and the corrosion products were mostly oxides, chlorides, sulfates and carbonates of copper and nickle.
KeywordElectrochemical Migration Raman-spectroscopy Pcb-imag Copper Contamination Temperature Reliability Mechanism Evolution Alloys
Subject AreaChemistry ; Electrochemistry ; Energy & Fuels ; Materials Science
Language英语
Document Type期刊论文
Identifierhttp://ir.nimte.ac.cn/handle/174433/17468
Collection2018专题
Recommended Citation
GB/T 7714
Xiao, Kui,Bai, Ziheng,Yan, Lidan,et al. Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(11):8877-8885.
APA Xiao, Kui.,Bai, Ziheng.,Yan, Lidan.,Yi, Pan.,Dong, Chaofang.,...&Li, Xiaogang.(2018).Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(11),8877-8885.
MLA Xiao, Kui,et al."Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.11(2018):8877-8885.
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