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The Application of High Impedance Surface for Noise Reduction inside the Package 会议论文
, AUG 03-08, 2014
Authors:  Wei, Xing-Chang;  Wei, Xin;  Li, Yong-Sheng;  Zhang, Jian-Bo;  Li, Er-Ping;  Dai, Gao-Le;  Wei, XC
Favorite  |  View/Download:19/0  |  Submit date:2018/01/12
High Impedance Surface  Shielding  Noise Coupling